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IRFR010, SiHFR010
www.vishay.com
PRODUCT SUMMARY
Power MOSFET
FEATURES
? Low Drive Current
Vishay Siliconix
V DS (V)
R DS(on) ( ? )
Q g (Max.) (nC)
Q gs (nC)
Q gd (nC)
V GS = 10 V
50
10
2.6
4.8
0.20
?
?
?
?
?
Surface Mount
Fast Switching
Ease of Paralleling
Excellent Temperature Stability
Material categorization: For definitions of compliance
Configuration
DPAK
(TO-252)
D
G
Single
D
please see www.vishay.com/doc?99912
DESCRIPTION
The power MOSFET technology is the key to Vishay’s
advanced line of power MOSFET transistors. The efficient
geometry and unique processing of this latest “State of the
Art” design achieves: very low on-state resistance
combined with high transconductance; superior reverse
energy and diode recovery dV/dt capability.
The power MOSFET transistors also feature all of the well
G
S
S
N-Channel MOSFET
established advantages of MOSFET’S such as voltage
control, very fast switching, ease of paralleling and
temperature stability of the electrical parameters.
Surface mount packages enhance circuit performance by
reducing stray inductances and capacitance. The DPAK
(TO-252) surface mount package brings the advantages of
power MOSFET’s to high volume applications where PC
Board surface mounting is desirable. The surface mount
option IRFR9012, SiHFR9012 is provided on 16 mm tape.
The straight lead option IRFU9012, SiHFU9012 of the device
is called the IPAK (TO-251).
They are well suited for applications where limited heat
dissipation is required such as, computers and peripherals,
telecommunication equipment, dc-to-dc converters, and a
wide range of consumer products.
ORDERING INFORMATION
Package
Lead (Pb)-free
DPAK (TO-252)
IRFR010PbF
SiHFR010-E3
ABSOLUTE MAXIMUM RATINGS (T C = 25 °C, unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
SYMBOL
V DS
V GS
LIMIT
50
± 20
UNIT
V
Continuous Drain Current
Pulsed Drain Current a
V GS at 10 V
T C = 25 °C
T C = 100 °C
I D
I DM
8.2
5.2
33
A
Avalanche Current b
I AS
1.5
Linear Derating Factor
0.20
W/°C
Maximum Power Dissipation
Peak Diode Recovery dV/dt c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) d
T C = 25 °C
for 10 s
P D
dV/dt
T J , T stg
25
2.0
- 55 to + 150
300
W
V/ns
°C
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V DD = 25 V, starting T J = 25 °C, L = 100 μH, R g = 25 ? .
c. I SD ? 8.2 A, dI/dt ? 130 A/μs, V DD ? 40 V, T J ? 150 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
S13-0167-Rev. B, 04-Feb-13
1
Document Number: 91420
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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